Silver glass chip adhesive
Silver glass chip adhesive
Ag glass adhesive, also known as silver glass chip adhesive, has been used as a substitute for AuSi in the semiconductor field for many years and has good stability. The typical sintering temperature is 400-450 degrees, and it is recommended to have a maximum continuous working temperature of 300 degrees.
Shanren New Material, the leader of silver sintering, launched Ag glass chip binder, which continues to help the development of China's wide band gap semiconductors. Ag glass Adhesive AS9355 has the following characteristics:
Due to the low elastic modulus of Ag glass (between 16-26ppm/K), the stress and expansion coefficient in chip packaging are low.
Due to its high thermal conductivity (60W/(m.K)) and high temperature resistance, Ag glass is one of the most promising materials for high temperature and high-power applications.
3 Ag glass Adhesive has good thermal temperature property and can pass the temperature change test of -60-200 ℃.
This product is mainly used for: fully sealed electronic device packaging; Bonding and packaging of various chips and gold plated ceramics or general ceramic devices. Due to the fact that the bonding layer of the sintered silver glass adhesive consists only of glass and precious metal powder, the water vapor rate of the sealed device is particularly low.
Ag glass Adhesive AS9355 has raised the application temperature of wide band gap chip bonding to a new height of 300 degrees, providing a good choice for high-power device packaging.
Ag glass adhesive, also known as silver glass chip adhesive, has been used as a substitute for AuSi in the semiconductor field for many years and has good stability. The typical sintering temperature is 400-450 degrees, and it is recommended to have a maximum continuous working temperature of 300 degrees.
Shanren New Material, the leader of silver sintering, launched Ag glass chip binder, which continues to help the development of China's wide band gap semiconductors. Ag glass Adhesive AS9355 has the following characteristics:
Due to the low elastic modulus of Ag glass (between 16-26ppm/K), the stress and expansion coefficient in chip packaging are low.
Due to its high thermal conductivity (60W/(m.K)) and high temperature resistance, Ag glass is one of the most promising materials for high temperature and high-power applications.
3 Ag glass Adhesive has good thermal temperature property and can pass the temperature change test of -60-200 ℃.
This product is mainly used for: fully sealed electronic device packaging; Bonding and packaging of various chips and gold plated ceramics or general ceramic devices. Due to the fact that the bonding layer of the sintered silver glass adhesive consists only of glass and precious metal powder, the water vapor rate of the sealed device is particularly low.
Ag glass Adhesive AS9355 has raised the application temperature of wide band gap chip bonding to a new height of 300 degrees, providing a good choice for high-power device packaging.
