DTS+TCB pre sintered silver solder pad process improves the flow c
DTS+TCB pre sintered silver solder pad process improves the flow capacity and power cycling ability of power devices
Sharex New Materials' GVF9700 pressureless pre sintered pads and GVF9800 pressured pre sintered pads bring multiple conveniences to customers, including the need for printing, dispensing, or drying. The GVF pre sintered silver solder pad process (DTS+TCB (Die Top System+Thick Cu Bonding) can effectively combine copper bonding wires with sintering techniques, while also having high flexibility, allowing multiple bonding wires to be connected to the pre sintered pad for top connection at the same time.
GVF pre sintered silver solder (DTS+TCB) not only significantly improves the conductivity and thermal conductivity of chip connections, as well as the reliability of chip connections, but also optimizes the performance of the entire module. It can also help customers improve productivity, reduce chip damage rates, and accelerate the launch time of the new generation of power electronics modules.
GVF pre sintered silver solder (DTS+TCB (Die Top System+Thick Cu Bonding)) can extend the service life of power electronic modules by more than 50 times and ensure that the current carrying capacity of the chip is increased by more than 50%.
The use of GVF pre sintered silver solder pads allows the device junction temperature to exceed 200 ° C. Therefore, GVF pre sintered silver solder can significantly reduce power limits or reduce chip size while ensuring the same current, thereby reducing power costs.
SHAREX's pre sintered silver solder GVF9800 (DTS+TCB (Die Top System+Thick Cu Bonding) is a composite material that combines sintered silver, copper foil, and other materials, consisting of the following four parts: copper foil with bonding function; Pre coated AS9385 series sintered silver; Temporary fixed adhesives can be used before sintering; Protective film or carrier.
GVF pre sintered silver solder (DTS+TCB (Die Top System+Thick Cu Bonding) and gold, silver and copper surface Shear strength are very large.
The usage method of GVF pre sintered silver solder (DTS+TCB (Die Top System+Thick Cu Bonding) is as follows: Pick&Place;
GVF pre sintered silver solder (DTS+TCB) can be widely used for Die Attach, Die Top Attach, Spacer Attach, etc.
Sharex New Materials' GVF9700 pressureless pre sintered pads and GVF9800 pressured pre sintered pads bring multiple conveniences to customers, including the need for printing, dispensing, or drying. The GVF pre sintered silver solder pad process (DTS+TCB (Die Top System+Thick Cu Bonding) can effectively combine copper bonding wires with sintering techniques, while also having high flexibility, allowing multiple bonding wires to be connected to the pre sintered pad for top connection at the same time.
GVF pre sintered silver solder (DTS+TCB) not only significantly improves the conductivity and thermal conductivity of chip connections, as well as the reliability of chip connections, but also optimizes the performance of the entire module. It can also help customers improve productivity, reduce chip damage rates, and accelerate the launch time of the new generation of power electronics modules.
GVF pre sintered silver solder (DTS+TCB (Die Top System+Thick Cu Bonding)) can extend the service life of power electronic modules by more than 50 times and ensure that the current carrying capacity of the chip is increased by more than 50%.
The use of GVF pre sintered silver solder pads allows the device junction temperature to exceed 200 ° C. Therefore, GVF pre sintered silver solder can significantly reduce power limits or reduce chip size while ensuring the same current, thereby reducing power costs.
SHAREX's pre sintered silver solder GVF9800 (DTS+TCB (Die Top System+Thick Cu Bonding) is a composite material that combines sintered silver, copper foil, and other materials, consisting of the following four parts: copper foil with bonding function; Pre coated AS9385 series sintered silver; Temporary fixed adhesives can be used before sintering; Protective film or carrier.
GVF pre sintered silver solder (DTS+TCB (Die Top System+Thick Cu Bonding) and gold, silver and copper surface Shear strength are very large.
The usage method of GVF pre sintered silver solder (DTS+TCB (Die Top System+Thick Cu Bonding) is as follows: Pick&Place;
GVF pre sintered silver solder (DTS+TCB) can be widely used for Die Attach, Die Top Attach, Spacer Attach, etc.
